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Performs design-generation and reviews for assigned leadframe & package responsibilities (e.g. package and tooling, leadframe, bond diagrams for new devices and computer simulations).
Ensures that the appropriate documents are in place for all new & existing design changes.
Liaise with Suppliers, R&D, QA and Operations teams to ensure Designs are optimal for Manufacturability
Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
Knowledge of Leadframe & Assembly/Test manufacturing is an advantage
Performs other functions as may be assigned from time to time by superior.
Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design & Software
Skills: Excellent Computer skills
Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design