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Partner with the business unit and program development team to develop assembly packaging technology solutions from design, prototyping and package qualification to meet technology and product roadmap for Wolfspeed RF Power Division.
Support Development for GaN/SiC on Copper & substrates for high power RF power applications.
Responsible for the project management, mitigation planning of all development design/technical, manufacturing, schedule and yield risks.
Support or lead NTI/NTPI system level improvements to ensure efficient product definition, approval and release in support of APQP requirements.
Perform Flip Chip and SMT Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competiveness and manufacturability.
Perform verification and qualification activities for new tooling, machines and materials in Development projects.
Facilitate DFMEA, ensuring products are effectively identified and documented. Ensure previous lessons learned are incorporated into new product risk analysis.
Responsible for technical handshake and knowledge transfer to Operation.
Support continuous yield and capability improvements for released technologies and products.
Bachelor’s/Master’s degree preferred in Material Science, Polymer Science, Material engineering, Chemistry, Chemical engineering, Physics, Electrical Engineering, Process Engineering, or other relevant specialization
At least > 6 years of experience in the process development or semiconductor packaging R&D.
Excellent communication and project management skills are required as successful qualification requires close interactions with all cross functional teams including Research & Development, Engineering, operations, reliability, marketing and leadership.
Demonstrated project management skills including the ability to effectively multi-task in a complex environment, including strong written and verbal communication skills.
Possess direct technical background and hands on experience in Die Attach, Flip-chip, SMT packaging processes, PCB design guidelines and/or other semiconductor processes.
Experience in high volume manufacturing, high power & RF application knowledge is preferred.
Knowledge of Flip-Chip Attach and various SMT assembly equipment. ( Datacon, ESEC, ASM, Palomar, Panasonic, Assembleon ) added advantages.
Analytical mindset and self-starter to confront difficult problems and challenge the team to high levels of performance.
Strong problem-solving skills and hands on experience on analysis skill such as JMP, Anova, FMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DOEs.
Able to written and verbal communication skills with proven ability to communicate to all levels with both internally and externally stakeholders
Knowledge in AutoCAD, Cadence, Ansys software will be advantages.
Knowledge in best practices of supplier chain management and strategies in semiconductor manufacturing assembly, module assembly and test processes preferred
Ability to work in a team environment both as a leader as well as team player contributor
Comfortable with a high-paced, diverse, multi-cultural, and global environment
Ability to manage and develop relationship with key business partners
Must be willing to travel