You will be a part of the leading edge of the conversion to Silicon Carbide, a technology that is leveraged in all things future including Electric Cars, Solar Energy, Charging Stations, and 5G Communications to name just a few.
Gain invaluable exposure to a wide array of manufacturing techniques and tools and be a part of driving the evolution of SiC Power Device development
You will work with vendors and customers from markets all over the globe and have a real impact on Cree’s future.

What can you do for Wolfspeed?

Working with our Wafer Fabs to report and react to wafer Test, Dice, and Inspection results.
Work directly with our contract manufacturing partners across the globe to improve the manufacturing capability and product performance across our product portfolio.
Resolve everyday manufacturing issues while addressing big picture challenges as we build the largest SiC based Power device company in the world.
Work with Engineers, Scientists, Designers, Technicians, and Operations leaders throughout the entire manufacturing process to lead projects and transfer in to production new products and processes.
Review test and yield trends across the Power Product Lines and be the first responder to yield anomalies.
Develop, document and deploy process improvements which enhance yield, cycle time, and long term reliability for SiC Power devices.
Document manufacturing process flows, requiring clear written and verbal communication skills. Documentation includes travelers, control plan, process flow spec, PFMEAs, inspection requirements, and split lot instructions.
Participation and ownership where appropriate of 8Ds for scrapped material and MRB data review and close-out.
Perform independently on routine assignments. Must be able to follow specific instructions to perform tasks that require a higher knowledge of engineering techniques in supporting SiC Power production requirements.
Mentoring, coaching and training of process technicians and operators.

What you need for success:

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Industrial Engineering or Materials Science.
2+ years of experience in semiconductor fabrication or back-end processing (probe, AVI, Saw) as a process or product engineer.
Ability to pull and analyze large data sets from manufacturing processing.
High energy and self-motivated individual with strong communication skills to deliver results in a timely manner.
This position requires the lawful ability to access technical data, information, and areas controlled by United States export control laws and regulations.

Highly preferred skills and certifications:

Demonstrated understanding of semiconductor back-end and assembly processing, including: dicing, die attach, wire bond, encapsulation.
5+ years of experience in semiconductor fabrication as a process, product or process integration engineer.
Demonstrated understanding of the science and technology needed to fabricate semiconductor devices including ion implantation, oxide growth, diffusion, photolithography, wet and dry etch, thin film deposition and metal deposition.
General understanding of the process flow for inspection, monitoring and disposition of semiconductor products. SiC experience is a plus.
Good working knowledge of semiconductor device physics.
Familiarity with ANOVA, DOE principles, SPC techniques, JMP software. JMP scripting is a plus.